Motherboard Specifications

Comprehensive Technical Details

Socket: Intel® LGA 1851 – supports Intel® Core™ Ultra (Series 2) processors

Chipset: Intel® B860 Express

Form Factor: Micro-ATX

Power Design & VRM: 12+1+2 Twin Digital VRM design with 6-layer PCB and 2× copper; 6+6 phase parallel architecture for CPU & memory delivery

الذاكرة: 4 منافذ DDR5 DIMM، قناة مزدوجة؛ تدعم DDR5 XMP وترددات حتى ~9200 ميجاهرتز (كسر السرعة)*

Expansion Slots: 1× PCIe 5.0 x16 (graphics card slot) + 1× PCIe 4.0 x16 (runs at x4)

Storage: 3× M.2 slots: 1× PCIe 5.0 x4 M.2 + 2× PCIe 4.0 x4 M.2, plus 4× SATA 6 Gb/s ports (RAID 0/1/5/10 supported)

Networking: Integrated Wi-Fi 6E with ultra-high-gain directional antenna + Realtek® 2.5 GbE LAN

USB Connectivity: USB4® Type-C with DisplayPort Alt (up to 40 Gbps) + multiple USB 3.2 / USB 2.0 ports

Display Outputs: 1× HDMI and 1× DisplayPort for integrated graphics

Thermal & Build Features: VRM Thermal Armor Advanced with 5 W/mK thermal pad, M.2 Thermal Guard, Smart Fan 6 support with multiple headers and dual fan-curve mode

ميزات صديقة للمستخدمين المتمرسين: EZ-Latch Plus (تصميم بدون براغي لـ PCIe وM.2)، Sensor Panel Link (منفذ فيديو على اللوحة لواجهة هيكل الحاسوب)

Ideal for: Enthusiast gaming or productivity builds requiring next-gen CPU/memory support, high-speed storage, Wi-Fi 6E, and a compact micro-ATX footprint